Evolution and Future of Electronics Packaging Technology

نویسندگان

چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Future visions deduced research needs in electronics packaging and production

The purpose of his paper is to identify and briefly discuss some important areas where (additional) research is needed to be able to within 5-20 years realize the four “example-visions” presented in www.netpack-europe.org, Visions Lab: Augmented Reality, Personal Liberator, Clever Paper and Healthy Freedom. In total these visions embrace very diverse technology areas, many of those extending ou...

متن کامل

Environmentally Responsible Electronics Packaging

he United States is running out of T landftlls and that is where most trash, and thus most packaging 1 material, ends up. For example, we generate 180 million tons of solid waste per year, 70% of which goes into landfills. However, in the last 12 years, two-thirds of our landfills have been exhausted. The problem gained national attention in 1989 when a garbage barge from New York wandered acro...

متن کامل

High Temperature Electronics Packaging

Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...

متن کامل

Parasitics in Power Electronics Packaging

In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the basis of their electrical and electromag...

متن کامل

Opto-Electronics Packaging And Failure Analysis Methodology

The demand for opto-electronics is increasing as we are nearing the future due to the need for high data rate, high bandwidth, lossless transmission and low electromagnetic interference sensitivity. The paper describes the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packa...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging

سال: 2013

ISSN: 1343-9677,1884-121X

DOI: 10.5104/jiep.16.422